SK Hynix plans to further expand HBM4 production capacity, aiming to increase output by 20,000 HBM wafers per month.

November 15 - According to South Korea's Electronic News, SK Hynix plans to further expand its high bandwidth memory (HBM4) production capacity. According to multiple semiconductor equipment company sources on November 15, SK Hynix is discussing orders for HBM4 production equipment with partners. It is reported that the company is mainly coordinating procurement timing and quantities with equipment suppliers responsible for back-end processes such as HBM bonding, cutting, and testing.

An informed SK Hynix supplier source said: "SK Hynix is advancing additional investment in HBM4 production equipment, with the goal of completing equipment move-in and installation commissioning in the first half of next year, and is currently accelerating related arrangements." It is reported that the company has asked some equipment to be delivered by the first quarter of next year at the latest, indicating that this capacity expansion plan is progressing relatively quickly.

The new capacity is expected to be mainly located at SK Hynix's P&T6 plant in Cheongju, South Korea. The plant, previously known as M8, is the HBM production base selected by SK Hynix in 2025, and the company began building an HBM production line there earlier this year. With this additional expansion decision, the company plans to further increase HBM4 capacity, possibly earlier than originally scheduled.

Another industry insider said: "The company plans to maximize the use of idle space at the P&T6 plant to increase HBM4 capacity. If the entire plant is fully put into operation, it can add more than 20,000 wafers per month of HBM capacity in wafer terms."