SK Hynix and SanDisk Release First HBF Standard Specification

August 4th—SK hynix announced that it has partnered with SanDisk to jointly release the first standard specification for the next-generation storage technology High Bandwidth Flash (HBF). It is reported that this standard specification, following SK hynix's collaboration with SanDisk in August last year to initiate the standardization of HBF, and the establishment of the alliance in February this year, is the first result achieved after about 6 months.

The specification defines two capacity configurations, using 8-layer and 16-layer NAND chip stacking, supporting up to 512GB capacity; and sets bandwidth standards in three grades (Grade 1~3), with data transfer capabilities ranging from approximately 0.4TB/s to 3.0TB/s.